Electrochemical deposition of layered copper thin films based on the diffusion limited aggregation

被引：35
|
作者：
Wei, Chenhuinan [1 ]
Wu, Guoxing [1 ]
Yang, Sanjun [1 ]
Liu, Qiming [1 ]
机构：
[1] Wuhan Univ, Sch Phys & Technol, Key Lab Ariticial Micro & Nanostruct, Minist Educ, Wuhan 430072, Peoples R China
来源：
SCIENTIFIC REPORTS | 2016年 / 6卷
基金：
中国国家自然科学基金;
关键词：
DENDRITIC GROWTH; NANOSTRUCTURES; SILVER; ELECTRODEPOSITION; NUCLEATION;
D O I：
10.1038/srep34779
中图分类号：
O [数理科学和化学]; P [天文学、地球科学]; Q [生物科学]; N [自然科学总论];
学科分类号：
07 ; 0710 ; 09 ;
摘要：
In this work layered copper films with smooth surface were successfully fabricated onto ITO substrate by electrochemical deposition (ECD) and the thickness of the films was nearly 60 nm. The resulting films were characterized by SEM, TEM, AFM, XPS, and XRD. We have investigated the effects of potential and the concentration of additives and found that 2D dendritic-like growth process leaded the formation of films. A suitable growth mechanism based on diffusion limited aggregation (DLA) mechanism for the copper films formation is presented, which are meaningful for further designing homogeneous and functional films.
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页数：7
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