Fundamental performance limits of heatsinks

被引:21
作者
Copeland, DW [1 ]
机构
[1] Fujitsu Labs Amer, San Jose, CA 95134 USA
关键词
D O I
10.1115/1.1569262
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Dedicated fan-duct-heatsink combinations have become a standard means of cooling computer processors. Most previous studies have considered optimization of fin geometry (pitch and thickness) with overall heatsink dimensions (width, height, length) fixed. The present study considers size requirements for the constraints of fixed air volume flow rate and pressure drop, fixed fan/blower power and fixed thermal conductance. First, an ideal heatsink with infinite fin thermal conductivity is considered, providing simple power-law prediction of performance. Next, fins of finite thermal conductivity and thickness, as well as effects of developing flow are included in the analysis, permitting prediction and minimization of weight. Models of both levels of complexity can be used, previous to more detailed numerical and/or experimental studies, to design optimized heatsinks.
引用
收藏
页码:221 / 225
页数:5
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