Wafer bonding technology and its optoelectronic applications

被引：14

作者：

Lo, YH

Zhu, ZH

Qian, Y

Ejeckam, FE

Christenson, GL

机构：

来源：

OPTOELECTRONIC INTEGRATED CIRCUITS | 1997年 / 3006卷

关键词：

wafer bonding; fusion; optoelectronics; integrated; laser; vertical cavity;

D O I：

10.1117/12.264243

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes the wafer bonding technology and its applications to optoelectronic devices and circuits. It shows that the wafer bonding technology can create new device structures with unique characteristics and can form integrated optoelectronic circuits containing optical, electronic and micro-mechanical devices.

引用

页码：26 / 35

页数：10