Surface modification and characterization of photodefinable epoxy/copper systems

被引：55

作者：

Ge, J ^{[1
]}

Turunen, MPK ^{[1
]}

Kivilahti, JK ^{[1
]}

机构：

[1] Aalto Univ, Lab Elect Prod Technol, FIN-02150 Espoo, Finland

来源：

THIN SOLID FILMS | 2003年 / 440卷 / 1-2期

基金：

芬兰科学院;

关键词：

adhesion; polymer; X-ray photoelectron spectroscopy; plasma; surface morphology; etching;

D O I：

10.1016/S0040-6090(03)00851-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effects of the wet-chemical and plasma treatments on the adhesion of electroless and sputter-deposited copper to the photodefinable epoxy have been investigated. The wet-chemical treatment increased the amounts of oxygen-containing functionalities on the epoxy surface mainly during the early stage of etching. With the longer etching the pronounced surface roughness was revealed in the form of microcavities. The plasma treatment increased significantly the polar component of surface free energy of the epoxy and produced low surface roughness. The physicochemical changes of the epoxy combined with the experimental adhesion results indicated that in the case of the electroless deposition the mechanical interlocking was the main adhesion mechanism. Sputter-deposited copper exhibited the highest pull strengths on the epoxy when the plasma pretreatment with oxygen was employed. The enhancement of the surface polarity of the epoxy and the enlarged surface contact area due to the increased roughness were the most important factors in the adhesion. (C) 2003 Elsevier Science B.V. All rights reserved.

引用

页码：198 / 207

页数：10

共 52 条

[31] PLASMA SURFACE MODIFICATION OF POLYMERS FOR IMPROVED ADHESION - A CRITICAL-REVIEW [J].

LISTON, EM ;

MARTINU, L ;

WERTHEIMER, MR .

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 1993, 7 (10) :1091-1127

[32] Chemical and mechanical adhesion mechanisms of sputter-deposited metal on epoxy dielectric for high density interconnect printed circuit boards [J].

Martin, LJ ;

Wong, CP .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (03) :416-424

[33]

MILLARD M, 1974, TECHNIQUES APPL PLAS

[34] Effect of roughness as determined by atomic force microscopy on the wetting properties of PTFE thin films [J].

Miller, JD ;

Veeramasuneni, S ;

Drelich, J ;

Yalamanchili, MR ;

Yamauchi, G .

POLYMER ENGINEERING AND SCIENCE, 1996, 36 (14) :1849-1855

[35]

Mittal K.L., 1998, Metallized Plastics

[36]

Mittal K.L., 1991, ACID BASE INTERACTIO

[37]

Neumann A., 1979, SURFACE COLLOID SCI, P31, DOI [DOI 10.1007/978-1-4615-7969-4_2, 10.1007/978-1-4615-7969-4_2]

[38] Atomic force microscopy study of polypropylene surfaces treated by UV and ozone exposure: modification of morphology and adhesion force [J].

Nie, HY ;

Walzak, MJ ;

Berno, B ;

McIntyre, NS .

APPLIED SURFACE SCIENCE, 1999, 144-45 :627-632

[39] EXCIMER-LASER POLYMER ABLATION - FORMATION OF POSITIVELY CHARGED SURFACES AND ITS APPLICATION INTO THE METALLIZATION OF POLYMER-FILMS [J].

NIINO, H ;

YABE, A .

APPLIED SURFACE SCIENCE, 1993, 69 (1-4) :1-6

[40] LIQUID SPREADING ON ROUGH METAL-SURFACES [J].

OLIVER, JF ;

MASON, SG .

JOURNAL OF MATERIALS SCIENCE, 1980, 15 (02) :431-437

← 1 2 3 4 5 6 →