共 50 条
- [41] MOCHA, modelling and characterization for SiP -: Signal and power integrity analysis 2008 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2008, : 85 - +
- [42] Effects of power bus stitching on signal integrity and thermal analysis 2003 IEEE International Symposium on Electromagnetic Compatibility (EMC), Vols 1 and 2, Symposium Record, 2003, : 539 - 542
- [43] Design of Panel Level Package and Power and Signal Integrity Analysis Int. Conf. Electron. Packag., ICEP, 2024, (273-274):
- [44] SIGNAL & POWER INTEGRITY CO-SIMULATION ON DDR MEMORY PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, : 641 - +
- [45] Power and Signal Integrity Challenges in 3D Systems 2013 50TH ACM / EDAC / IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2013,
- [47] Signal integrity impact of ultra low power IO initiatives Electrical Performance of Electronic Packaging, 2006, : 7 - 10
- [49] Compact Parameterized Macromodels for Signal and Power Integrity analysis of RF and Mixed Signal Systems 2013 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2013, : 40 - 43
- [50] Optimum signal integrity through appropriate analysis of signal return path and power delivery 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1402 - 1407