Demystifying Signal and Power Integrity

被引:5
|
作者
Boss, Hermann [1 ]
机构
[1] Rohde & Schwarz GmbH & Co KG, Test & Measurement Div, Munich, Germany
关键词
D O I
10.1109/MMM.2011.941406
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This special issue is a tribute to some of the best signal and power integrity experts worldwide. It is an honor to have the opportunity to work with these colleagues, and I am very grateful for their willingness to go through the effort of sharing their thoughts and ideas. Furthermore, I am grateful to the friends and colleagues of the Technical Committee (TC) MTT-9 on Digital Signal Processing, who have given me the confidence to be the chair of that TC. © 2011 IEEE.
引用
收藏
页码:6 / 10
页数:3
相关论文
共 50 条
  • [21] Package Design Methodology in Consideration with Signal Integrity, Power Integrity and Electromagnetic Immunity
    Pu, Bo
    Kim, Kwangho
    Nah, Wansoo
    2014 XXXITH URSI GENERAL ASSEMBLY AND SCIENTIFIC SYMPOSIUM (URSI GASS), 2014,
  • [22] Power integrity/signal integrity co-simulation for fast design closure
    Srinivasan, K
    Mandrekar, R
    Engin, E
    Swaminathan, M
    PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 49 - 53
  • [23] Signal integrity issues at split ground and power planes
    Liaw, HJ
    Merkelo, H
    46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, : 752 - 755
  • [24] Power supply noise monitor for signal integrity faults
    Vázquez, JR
    de Gyvez, JP
    DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1406 - 1407
  • [25] On Vector Fitting Methods in Signal/Power Integrity Applications
    Lei, Chi-Un
    Wang, Yuanzhe
    Chen, Quan
    Wong, Ngai
    INTERNATIONAL MULTICONFERENCE OF ENGINEERS AND COMPUTER SCIENTISTS (IMECS 2010), VOLS I-III, 2010, : 1407 - 1412
  • [26] Signal Power Integrity and Design Consideration in Package Modeling
    Zhao, Jin
    Chan, Edward K.
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 71 - +
  • [27] Modeling of signal and power integrity in system on package applications
    Swaminathan, Madhavan
    Engin, A. Ege
    2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY: WORKSHOP AND TUTORIAL NOTES, VOLS 1-3, 2007, : 964 - 969
  • [28] Demystifying power quality
    Detroz, T.
    Holland, A.
    Engineering Technology, 2001, 4 (11):
  • [29] From surface roughness modeling to surface roughness engineering signal integrity and power integrity
    Ye X.
    Ye, Xiaoning, 1600, Institute of Electrical and Electronics Engineers Inc. (09): : 60 - 61
  • [30] Stochastic Approach for Power Integrity, Signal integrity, EMC and EMI Analysis of Moving Objects
    Wane, Sidina
    Doussin, Olivier
    Bajon, Damienne
    Russer, Johannes
    Russer, Peter
    PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON ELECTROMAGNETICS IN ADVANCED APPLICATIONS (ICEAA), 2015, : 1554 - 1557