Binding Interactions in Copper, Silver and Gold π-Complexes

被引:27
|
作者
Mehara, Jaya [1 ]
Watson, Brandon T. [2 ]
Noonikara-Poyil, Anurag [2 ]
Zacharias, Adway O. [2 ]
Roithova, Jana [1 ]
Dias, H. V. Rasika [2 ]
机构
[1] Radboud Univ Nijmegen, Inst Mol & Mat, Dept Spect & Catalysis, Heyendaalseweg 135, NL-6525 AJ Nijmegen, Netherlands
[2] Univ Texas Arlington, Dept Chem & Biochem, Arlington, TX 76019 USA
基金
欧洲研究理事会; 美国国家科学基金会;
关键词
alkene ligands; alkyne ligands; bond energy; mass spectrometry; X-ray diffraction; COINAGE METALS; STRUCTURAL-CHARACTERIZATION; COPPER(I)-OLEFIN COMPLEXES; CRYSTAL-STRUCTURES; OLEFIN COMPLEXES; ALKYNE COMPLEXES; ETHYLENE ADDUCTS; NITRENE-TRANSFER; ACETYLENE; COORDINATION;
D O I
10.1002/chem.202103984
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The copper(I), silver(I), and gold(I) metals bind pi-ligands by sigma-bonding and pi-back bonding interactions. These interactions were investigated using bidentate ancillary ligands with electron donating and withdrawing substituents. The pi-ligands span from ethylene to larger terminal and internal alkenes and alkynes. Results of X-ray crystallography, NMR, and IR spectroscopy and gas phase experiments show that the binding energies increase in the order Ag<Cu<Au and the binding energies are slightly higher for alkynes than for alkenes. Modulation of the electron density at the metal using substituents on the ancillary ligands shows that the pi-back bonding interaction plays a dominant role for the binding in the copper and gold complexes.
引用
收藏
页数:11
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