A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

被引：216
作者：
Shnawah, Dhafer Abdulameer [1 ]
Sabri, Mohd Faizul Mohd [1 ]
Badruddin, Irfan Anjum [1 ]
机构：
[1] Univ Malaya, Dept Mech Engn, Kuala Lumpur 50603, Malaysia
来源：
MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 01期
关键词：
LEAD-FREE SOLDERS; SN-AG; FATIGUE PROPERTIES; SILVER CONTENT; MECHANICAL-PROPERTIES; STRAIN; DEFORMATION; NI; INTERCONNECTS; MICROSTRUCTURE;
D O I：
10.1016/j.microrel.2011.07.093
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Currently, the portable electronic products trend to high speed, light weight, miniaturization and multi-functionality. In that field, solder joint reliability in term of both drop impact and thermal cycling loading conditions is a great concern for portable electronic products. The transition to lead-free solder happened to coincide with a dramatic increase in portable electronic products. Sn-Ag-Cu (SAC) is now recognized as the standard lead free solder alloy for packaging interconnects in the electronics industry. The present study reviews the reliability of different Ag-content SAC solder joints in term of both thermal cycling and drop impact from the viewpoints of bulk alloy microstructure and tensile properties. The finding of the study indicates that the best SAC composition for drop impact performance is not necessarily the best composition for optimum thermal cycling reliability. The level of Ag-content in SAC solder alloy can be an advantage or a disadvantage depending on the application, package and reliability requirements. As a result, most component assemblers are using at least two (and in many cases even more) lead-free solder sphere alloys to meet various package requirements. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码：90 / 99
页数：10
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