Heat flow into periodic array of interface cracks

被引：1
|
作者：
Weiss, Noah A. [1 ]
Keer, Leon M. [1 ]
机构：
[1] Northwestern Univ, Evanston, IL 60208 USA
来源：
MECHANICS OF MATERIALS | 2015年 / 88卷
关键词：
Interface crack; Periodic; Thermoelastic; Conformal mapping; Stress intensity factor; Crack opening displacement; DISSIMILAR MATERIALS; CONTACT; KINKING;
D O I：
10.1016/j.mechmat.2015.04.013
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A bonded bimaterial consisting of two homogeneous, dissimilar materials is considered. A periodic array of imperfections in the bond along the interface disturb uniform heat flux in the far field, and result in residual thermal stresses. Stresses, stress intensity factors, and crack opening displacements are determined for two different cases of relative distortivity of the constituent materials. (C) 2015 Elsevier Ltd. All rights reserved.
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页码：61 / 72
页数：12
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