Heterogeneous Integration for Silicon Photonic Systems: Challenges and Approaches

被引：3

作者：

Dallesasse, John M. ^{[1
]}

Carlson, John A. ^{[1
]}

Ganjoo, Manaav

Espenhahn, Leah

机构：

[1] Univ Illinois, Champaign, IL 61820 USA

来源：

2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM) | 2021年

基金：

美国国家科学基金会;

关键词：

Heterogeneous Integration; Silicon Photonics; Manufacturing; CMOS; LASERS; SI;

D O I：

10.1109/EDTM50988.2021.9420896

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The promise of silicon integrated circuits with their electronic or photonic functionality enhanced via heterogeneous integration has motivated significant work in understanding and overcoming the barriers to realizing such an IC. Additional hurdles must be overcome when integrating devices that are highly sensitive to temperature variation such as semiconductor lasers. Challenges in the heterogeneous integration process will be reviewed, and approaches for heterogeneous integration that have the potential to enable silicon ICs with enhanced functionality will be discussed in the context of integrated photonic systems.

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页数：3

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