On the mechanism of material removal at the nanoscale by cutting

被引：19

作者：

Komanduri, R. ^{[1
]}

Varghese, S. ^{[2
]}

Chandrasekaran, N. ^{[2
]}

机构：

[1] Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA

[2] Micron Technol Inc, Boise, ID 83707 USA

来源：

WEAR | 2010年 / 269卷 / 3-4期

关键词：

Mechanical polishing; Finishing; Material removal; Nanometric cutting; AFM; MODEL; SILICON; WEAR;

D O I：

10.1016/j.wear.2010.03.024

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Material removal by machining at the nanoscale is simulated with an atomic force microscope (AFM) by in situ scratching of a ductile workmaterial (aluminum) by a hard tool (the diamond stylus of an AFM). In view of nanometric depths of cut and large radius of the tool used in the finishing operations, the material is pushed mostly to the sides by ploughing instead of chip formation in front of the tool. This mechanism is in sharp contrast to the material removal mechanism at the macroscale, as in conventional cutting, wherein all the material is removed in the form of ductile chips in front of the tool rake face and at microscale, as in grinding, wherein most of the material is removed in the form of highly deformed chips ahead of the rake face of a large negative rake tool and some side spread by ploughing due to plane stress conditions. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：224 / 228

页数：5

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