Dopant Segregation and Nickel Stanogermanide Contact Formation on p+ Ge0.947Sn0.053 Source/Drain

被引:37
作者
Han, Genquan [1 ]
Su, Shaojian [2 ]
Zhou, Qian [1 ]
Guo, Pengfei [1 ]
Yang, Yue [1 ]
Zhan, Chunlei [1 ]
Wang, Lanxiang [1 ]
Wang, Wei [1 ]
Wang, Qiming [2 ]
Xue, Chunlai [2 ]
Cheng, Buwen [2 ]
Yeo, Yee-Chia [1 ]
机构
[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore
[2] Chinese Acad Sci, State Key Lab Integrated Optoelect, Inst Semicond, Beijing 100083, Peoples R China
基金
新加坡国家研究基金会; 中国国家自然科学基金;
关键词
Contact resistance R-C; dopant segregation (DS); germanium-tin (Ge1-xSnx); Ni(Ge1-xSnx); SCHOTTKY-BARRIER HEIGHT;
D O I
10.1109/LED.2012.2186430
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
P+Ge1-xSnx is a promising source and drain (S/D) stressor material for Ge p-MOSFETs, and an S/D material in Ge1-xSnx channel p-MOSFETs. In this paper, we investigate the dopant segregation (DS) effects in the stanogermanidation of p(+)Ge(0.947)Sn(0.053) (boron-doped). A study comparing the contact resistance R-C of nickel stanogermanide [Ni(Ge1-xSnx) or Ni(GeSn)] contact on p(+)Ge(1-x)Sn(x) and nickel germanide (NiGe) contact on p(+) Ge was performed. A more pronounced DS effect is achieved during the stanogermanidation in comparison with the NiGe/p(+) Ge control. R-C is 44% lower in the Ni(Ge1-xSnx)/p(+) GeSn structure as compared to the NiGe/p(+) Ge control. The reduced R-C is attributed to a more significant DS effect and the lower bandgap of Ge1-xSnx as compared with Ge.
引用
收藏
页码:634 / 636
页数:3
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