Electrochemical nickel-phosphorus alloy formation

被引:80
作者
Daly, BP [1 ]
Barry, FJ
机构
[1] Limerick Inst Technol, Ctr Res Electrochem Novel Technol, Dept Appl Sci, Limerick, Ireland
[2] Univ Limerick, Mat & Surface Sci Inst, Limerick, Ireland
关键词
D O I
10.1179/095066003225008482
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
What is believed to be the first comprehensive review on electrochemical nickel-phosphorus alloy formation is presented. Nickel-phosphorus deposits are important surface finishes for industrial materials owing to their electrocatalytic activity for hydrogen evolution, special paramagnetic characteristics, excellent microhardness and corrosion resistance. Nickelphosphorus is a relatively complex system and can form a number of stable compounds. Two mechanisms for the incorporation of phosphorus during electrodeposition of Ni-P have been proposed: a direct and an indirect mechanism. In the direct mechanism, the oxyacid in the bath, i.e. phosphorous acid (H3PO3), is reduced solely to the elemental state. In the indirect mechanism, phosphine (PH3) is an intermediate stage in the formation of the Ni-P alloy. Electrodeposition of nickel takes place in a fee structure with co-deposition of phosphorus in octahedral interstitial sites. The pH of the plating solutions is an important consideration for the electrodeposition of phosphorus alloys. It is well known that above a critical phosphorus content, the Ni-P alloy becomes amorphous; amorphous alloys tend to be harder and have higher contact resistance than their crystalline counterparts. Amorphous alloys prepared by electrodeposition are generally brittle or of low ductility.
引用
收藏
页码:326 / 338
页数:13
相关论文
共 97 条
[1]  
ARMYANOV S, 1992, MET FINISH, V90, P61
[2]  
ASM International, 1994, ASM Handbook, V5
[3]   PREPARATION AND CRYSTALLIZATION BEHAVIOR OF AMORPHOUS NICKEL-PHOSPHORUS THIN FILMS [J].
BAGLEY, BG ;
TURNBULL, D .
ACTA METALLURGICA, 1970, 18 (08) :857-&
[4]   STRUCTURE STUDY OF AN AMORPHOUS ELECTRODEPOSITED NICKEL-PHOSPHORUS ALLOY [J].
BAGLEY, BG ;
TURNBULL, D .
JOURNAL OF APPLIED PHYSICS, 1968, 39 (12) :5681-&
[5]  
BAGLEY BG, 1965, B AM PHYS SOC, V10, P1101
[6]  
BARAZ Z, 1990, ACTA CHIM HUNG, V127, P535
[7]  
BERKH O, 1995, PLAT SURF FINISH, V82, P62
[8]  
Bodnevas A, 1996, T MET FINISH INDIA, V5, P243
[9]   Thermal stability of electrodeposited Ni-P alloys [J].
Bonino, JP ;
BruetHotellaz, S ;
Bories, C ;
Pouderoux, P ;
Rousset, A .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1997, 27 (10) :1193-1197
[10]   AN INSITU TEM STUDY OF THE THERMAL-STABILITY OF NANOCRYSTALLINE NI-P [J].
BOYLAN, K ;
OSTRANDER, D ;
ERB, U ;
PALUMBO, G ;
AUST, KT .
SCRIPTA METALLURGICA ET MATERIALIA, 1991, 25 (12) :2711-2716