Current sharing among filaments for Bi-2223Ag-sheathed tapes with inter-filament barrier
被引:1
作者:
论文数: 引用数:
h-index:
机构:
Kajikawa, K.
Iiyama, Y.
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h-index: 0
机构:Kyushu Univ, Res Inst Superconductor Sci & Syst, Fukuoka 8128581, Japan
Iiyama, Y.
Enpuku, K.
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h-index: 0
机构:Kyushu Univ, Res Inst Superconductor Sci & Syst, Fukuoka 8128581, Japan
Enpuku, K.
Funaki, K.
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h-index: 0
机构:Kyushu Univ, Res Inst Superconductor Sci & Syst, Fukuoka 8128581, Japan
Funaki, K.
机构:
[1] Kyushu Univ, Res Inst Superconductor Sci & Syst, Fukuoka 8128581, Japan
[2] Kyushu Univ, Dept Elect & Syst Engn, Higashi Ku, Fukuoka 8128581, Japan
来源:
PHYSICA C-SUPERCONDUCTIVITY AND ITS APPLICATIONS
|
2007年
/
463卷
/
852-856期
关键词:
Bi-2223Ag-sheathed tape;
current distribution;
multifilament structure;
resistive barrier;
D O I:
10.1016/j.physc.2007.04.271
中图分类号:
O59 [应用物理学];
学科分类号:
摘要:
Current distribution in Bi-2223 multifilamentary tapes with inter-filament barrier is numerically evaluated for the application of an alternating transport current. In the case of barrier materials with an infinite resistivity, the current distribution can be determined with a lumped parameter circuit model including the inductances and resistances of all the filaments. The mutual inductance between a pair of filaments is obtained by estimating their geometric mean distance. The power-law model is also assumed to take into account the effect of resistance in each filament. The influences of the silver ratio and filament number in the tape wire on the current distribution are discussed systematically as well as the power index and frequency. (C) 2007 Elsevier B.V. All rights reserved.