Effect of thermal conduction path deficiency on thermal properties of LEDs package

被引：37

作者：

Ben Abdelmlek, Khaoula ^{[1
]}

Araoud, Zouhour ^{[1
]}

Ghnay, Rabie ^{[1
]}

Abderrazak, Kamel ^{[2
]}

Charrada, Kamel ^{[1
]}

Zissis, Georges ^{[3
]}

机构：

[1] Unite Etud Milieux Ionises & Reactifs, 5019 Route Kairouan, Monastir, Tunisia

[2] Unite Therm & Thermodynam Proc Ind, 5019 Route Kairouan, Monastir, Tunisia

[3] Lab Plasma & Convers Energie, 118 Route Narbonne, F-31062 Toulouse, France

来源：

APPLIED THERMAL ENGINEERING | 2016年 / 102卷

关键词：

Numerical modeling; Natural convection; LED chip number; Thermal conduction path deficiency; RADIAL HEAT SINK; NATURAL-CONVECTION; OPTIMIZATION;

D O I：

10.1016/j.applthermaleng.2016.03.100

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

This paper presents the details of a numerical study of the LEDs thermal conduction path deficiency. A three-dimensional numerical modeling using COMSOL Multiphysics (R) simulation software has been developed. The model was then validated by the literature, showed a good agreement. The effect of the number of LED-chips put on substrate was studied since it can affect the junction temperature and participate severely on the LED degradation. In addition, when there is trouble in the LED package, junction temperature can increase widely with no indication from the heat sink temperature, even with an efficient heat sink design. To justify this fact, a study of the effect of a deficient thermal conduction path between the heat sink and the thermal grease was performed by two methods: adding an air layer between the TIM and the heat sink, and modifying the effective thermal conductivity of the TIM. Its effects on the junction temperature, the heat sink average temperature, the total thermal resistance and the luminous flux was also investigated and it was found that a deficient thermal path affects severely the thermal properties of LED package even with an efficient heat sink. (C) 2016 Elsevier Ltd. All rights reserved.

引用

页码：251 / 260

页数：10