High aspect ratio channel fabrication with near-infrared laser-induced backside wet etching

被引：19
作者：
Kwon, Kui-Kam [1 ]
Kim, Haan [2 ]
Kim, Taekyum [1 ]
Chu, Chong Nam [1 ]
机构：
[1] Seoul Natl Univ, 1 Kwanak Ro, Seoul 08826, South Korea
[2] Dongyang Mirae Univ, 445 Gyoungin Ro, Seoul 08221, South Korea
来源：
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY | 2020年 / 278卷
基金：
新加坡国家研究基金会;
关键词：
Laser-induced backside wet etching (LIBWE); Glass; Phosphoric acid; High aspect ratio; Microchannel; SILICA GLASS; ABLATION; MICROSTRUCTURES; CORROSION; PULSES; MODEL;
D O I：
10.1016/j.jmatprotec.2019.116505
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Laser-induced backside wet etching (LIBWE) is one of the most promising manufacturing processes for fabricating high aspect ratio microfeatures of glass. However, cracks inside the glass during the LIBWE process due to high thermal stress limits the manufacturable shape. In this study, we propose a new technique to prevent the crack generation in the near-infrared (NIR) LIBWE process by adding phosphoric acid to the absorbent. It was possible to increase the maximum fabricable depth by approximately five times compared to the absorbent without phosphoric acid. The nature of the crack suppression mechanism in the absorbent with added phosphoric acid was investigated by in situ observation of the process and chemical analysis. To investigate the effects of phosphoric acid on LIBWE with added phosphoric acid, the influences of phosphoric acid concentration on maximum fabricable depth, fabrication speed and sidewall roughness were studied. Based on the investigated principle and process characteristics, we found that high aspect ratio microchannels of different shapes could be produced.
引用
收藏
页数：13
相关论文
共 50 条
  • [1] Incubation effect during laser-induced backside wet etching of sapphire using high-repetition-rate near-infrared nanosecond lasers
    Long, Jiangyou
    Zhou, Caixia
    Cao, Zhouquan
    Xie, Xiaozhu
    Hu, Wei
    OPTICS AND LASER TECHNOLOGY, 2019, 109 : 61 - 70
  • [2] Thermoplasmonic laser-induced backside wet etching
    Shubny, A. G.
    Epifanov, E. O.
    Minaev, N. V.
    Yusupov, V. I.
    JOURNAL OF LASER APPLICATIONS, 2022, 34 (03)
  • [3] Etching a micro-trench with a maximum aspect ratio of 60 on silica glass by Laser-induced backside wet etching (LIBWE)
    Kawaguchi, Y
    Sato, T
    Narazaki, A
    Kurosaki, R
    Niino, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2005, 44 (1-7): : L176 - L178
  • [4] Fabrication of deep microtrenches with inclined parts by laser-induced backside wet etching
    Sato, Tadatake
    Kurosaki, Ryozo
    Kawaguchi, Yoshizo
    Narazaki, Aiko
    Niino, Hiroyuki
    2009 LASERS & ELECTRO-OPTICS & THE PACIFIC RIM CONFERENCE ON LASERS AND ELECTRO-OPTICS, VOLS 1 AND 2, 2009, : 470 - 471
  • [5] Flexible fabrication of deep microstructures by laser-induced backside wet etching
    Sato, Tadatake
    Kurosaki, Ryozo
    Narazaki, Aiko
    Kawaguchi, Yoshizo
    Niino, Hiroyuki
    LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING XV, 2010, 7584
  • [6] Thermoplasmonic laser-induced backside wet etching of sapphire
    Tsvetkov, M. Yu
    Minaev, N., V
    Akovantseva, A. A.
    Timashev, P. S.
    Muslimov, A. E.
    Kanevskii, V. M.
    QUANTUM ELECTRONICS, 2019, 49 (02) : 133 - 140
  • [7] On the mechanisms of single-pulse laser-induced backside wet etching
    Tsvetkov, M. Yu.
    Yusupov, V. I.
    Minaev, N. V.
    Akovantseva, A. A.
    Timashev, P. S.
    Golant, K. M.
    Chichkov, B. N.
    Bagratashvili, V. N.
    OPTICS AND LASER TECHNOLOGY, 2017, 88 : 17 - 23
  • [8] Etching of fused silica fiber by metallic laser-induced backside wet etching technique
    Vass, Cs.
    Kiss, B.
    Kopniczky, J.
    Hopp, B.
    APPLIED SURFACE SCIENCE, 2013, 278 : 241 - 244
  • [9] Interpretation and Modeling of Laser-Induced Backside Wet Etching Procedure
    Vass, Csaba
    Budai, Judit
    Schay, Zoltan
    Hopp, Bela
    JOURNAL OF LASER MICRO NANOENGINEERING, 2010, 5 (01): : 43 - 47
  • [10] Effect of liquid environment on laser-induced backside wet etching of fused silica
    Lee, Taehwa
    Jang, Deoksuk
    Ahn, Daehwan
    Kim, Dongsik
    JOURNAL OF APPLIED PHYSICS, 2010, 107 (03)
12345