Recent Development and Status of High-Power LED Heat Release Technology

被引：0

作者：

Wang, Yiwei ^{[1
]}

Niu, Pingjuan ^{[2
]}

Zhang, Jianxin ^{[2
]}

Liu, Junru ^{[1
]}

机构：

[1] Tianjin Polytech Univ, Sch Informat & Commun Engn, Tianjin 300160, Peoples R China

[2] Tianjin Polytech Univ, Engn Res Ctr Solid State Lighting, Tianjin 300160, Peoples R China

来源：

PROCEEDINGS OF 2010 ASIA-PACIFIC YOUTH CONFERENCE ON COMMUNICATION, VOLS 1 AND 2 | 2010年

关键词：

high-power LED; heat dissipation structure; heat sink; package;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

High-power LED device is the key to Solid State lighting. It has been increasingly used in street lamps, projection lamps and other general lighting areas. As the LED input power increased, the large power dissipation bring a lot of heat, leading to the rise in LED junction temperature. The junction temperature of LED directly affects the light efficiency, emission wavelength, luminous flux, the device life and reliability etc. It has been one of the key issues of LED industrialization to improve the heat dissipation capacity of high-power LED now. This article mainly analyzes the domestic and foreign high-power LED's package structure, the heat sink technology research and development situation, sums up the future development trend of high-power LED heat dissipation, gives reasonable structures and optimizes the selection of suitable heat sinks, which may be an important direction for future development of high-power LED heat dissipation.

引用

页码：205 / +

页数：2

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