Femtosecond laser drilling of high-aspect ratio microchannels in glass

被引：84

作者：

Zhao, Xin ^{[1
]}

Shin, Yung C. ^{[1
]}

机构：

[1] Purdue Univ, Sch Mech Engn, Ctr Laser Based Mfg, W Lafayette, IN 47907 USA

来源：

APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2011年 / 104卷 / 02期

基金：

美国国家科学基金会;

关键词：

WAVE-GUIDES; PULSES; SILICA; MICROFLUIDICS; FABRICATION; ABLATION; SURFACE; FUTURE; OPTICS;

D O I：

10.1007/s00339-011-6326-z

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A femtosecond laser is used to fabricate microchannels with high aspect ratios by laser direct ablation. Drilling both in air and in water is investigated. It is found that at low pulse energy, drilling in water can generate channels with high aspect ratios. However, at high pulse energy, water-assisted drilling stops working and only very shallow holes can be obtained. The reason for this is presented. On the contrary, the aspect ratio of holes drilled in air increases significantly at high pulse energy. The effects of writing speed and repeated fabrication are also investigated, and an optimum writing speed is determined for fixed laser parameters.

引用

页码：713 / 719

页数：7

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