Loop heat pipe technology for electronics cooling

被引:0
作者
Khrustalev, D [1 ]
机构
[1] Thermacore Int Inc, Lancaster, PA 17601 USA
来源
2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS | 2001年 / 4428卷
关键词
Loop heat pipe; capillary structure; electronics cooling; passive device;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Loop hear pipes (LHPs) are passive hear transport devices with the capillary-driven circulation of the two-phase working fluid. LHPs currently used mainly in Aerospace applications due to their relatively high fabrication cost. LHPs outperform conventional heat pipes in terms of the maximum heat transport capability, operation in any orientation in the gravity field, and heat transport length. It can be advantageous to use loop heat pipes for transporting, spreading, and dissipating heat in modern electronics, where the heat dissipation pel unit volume is rapidly increasing This paper describes some LHP design features and experimental results obtained for two "low-cost" LHPs.
引用
收藏
页码:375 / 380
页数:6
相关论文
共 4 条
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[2]  
GERNERT N, 1998, 33 INT ENG C EN CONV
[3]  
KHRUSTALEV D, 1999, INT HEAT PIPE C TOK
[4]  
MAYDANIK YF, 1985, Patent No. 4515209