Research trends in lead-free soldering in the US: NCMS lead-free solder project

被引：2

作者：

Artaki, I ^{[1
]}

Noctor, D ^{[1
]}

Desantis, C ^{[1
]}

Desaulnier, W ^{[1
]}

Felton, L ^{[1
]}

Palmer, M ^{[1
]}

Felty, J ^{[1
]}

Greaves, J ^{[1
]}

Handwerker, C ^{[1
]}

Mather, J ^{[1
]}

Schroeder, S ^{[1
]}

Napp, D ^{[1
]}

Pan, TY ^{[1
]}

Rosser, J ^{[1
]}

Vianco, P ^{[1
]}

Whitten, G ^{[1
]}

Zhu, Y ^{[1
]}

机构：

[1] Lucent Technol, Engn Res Ctr, Princeton, NJ 08542 USA

来源：

FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS | 1999年

关键词：

D O I：

10.1109/ECODIM.1999.747683

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

In 1997, the National Center for Manufacturing Sciences Lead-Free Solder Project carried out by a consortium of II industrial corporations, academic institutions, and national laboratories completed its four year program to identify and evaluate alternatives to eutectic tin-lead solder. Participating organizations were AT&T/Lucent Technologies, the Navy's Electronics Manufacturing Productivity Facility (EMPF), Ford Motor Company, GM\Delco Electronics, GM\Hughes Aircraft, the National Institute for Standards and Technology (NIST), Rensellaer Polytechnic Institute (RPI), Rockwell International, Sandia National Laboratories, Texas Instruments and United Technologies\Hamilton Standard. The goal of the project was to determine whether safe, reliable, non-toxic, and cost-effective substitutes exist for lead-bearing solders in electronics manufacturing. To find an alternative to lead in solders requires gaining knowledge equivalent to the knowledge base already in existence for lead-bearing solders. The production of durable, reliable, safe, and affordable electronic products with lead-free solders requires the manufacturer to understand material properties, manufacturing processes and equipment, toxicological effects, alloy cost and long-term availability, and reliability. This talk summarized the major results of this multiyear research program, including manufacturing and reliability trials, and studies of the root causes of "fillet lifting" in plated through hole joints. The following text is an abridged version of the Executive Summary from the Final Report produced by the NCMS Lead-Free Solder Project; the complete Report can be obtained from NCMS.

引用

页码：602 / 605

页数：4