Numerical and Experimental Investigation of Single Event Effects in SOI Lateral Power MOSFETs

被引:36
作者
Shea, Patrick M. [1 ]
Shen, Z. John [1 ]
机构
[1] Univ Cent Florida, Dept Elect Engn & Comp Sci, Orlando, FL 32816 USA
关键词
Heavy ions; LDMOS; power devices; radiation effects; single event burnout; single event gate rupture; SEGR FAILURE; DAMAGE;
D O I
10.1109/TNS.2011.2172956
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
150 V SOI lateral power MOSFETs were designed and fabricated with features intended to provide hardness against SEB and SEGR. The response of SOI power MOSFETs to heavy ion radiation was investigated both experimentally and using TCAD simulations. These power MOSFETs demonstrated an electrical performance figure of merit Q(GD) x R-DSON considerably improved over state of the art commercial trench VDMOS and rad-hard planar VDMOS devices, and survived heavy ion irradiation at the full V-DS biasing of 150 V and full V-GS biasing of -16 V simultaneously.
引用
收藏
页码:2739 / 2747
页数:9
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