Innovative technology for material deposition in manufacturing electronics

被引：0

作者：

Schoeppler, J. Martin W. ^{[1
]}

Creagh, Linda T. ^{[1
]}

机构：

[1] Spectra Inc, Santa Clara, CA 95050 USA

来源：

IDMC 05: PROCEEDINGS OF THE INTERNATIONAL DISPLAY MANUFACTURING CONFERENCE 2005 | 2005年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Ink jet printheads are now widely used in manufacturing processes that require precise dispending of materials. In response to requirements for dispensing novel electronic fluids, we are developing next generation jetting technology based on our silicon MEMS technology with a three-dimensional silicon technology and a piezo based pumping chamber integrated into the chip structure. Examples of opportunities and applications in electronics packaging for MEMS-based ink jet technology will be presented.

引用

页码：390 / 391

页数：2