Bi-Resonant Scanning Mirror with Piezo-Resistive Position Sensor for WVGA Laser Projection Systems

被引:12
作者
Drabe, Christian [1 ]
Kallweit, David [1 ]
Dreyhaupt, Andre [1 ]
Grahmann, Jan [1 ]
Schenk, Harald [1 ]
Davis, Wyatt [2 ]
机构
[1] Fraunhofer Inst Photon Microsyst IPMS, Maria Reiche Str 2, D-01109 Dresden, Germany
[2] Micro Vis, Redmond, WA 98052 USA
来源
MOEMS AND MINIATURIZED SYSTEMS XI | 2012年 / 8252卷
关键词
MOEMS; MEMS; Scanning mirror; resonant; piezo resistive; sensor; TMAH; etch stop;
D O I
10.1117/12.910203
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Fraunhofer IPMS developed a new type of small-sized scanning mirror for Laser projection systems in mobile applications. The device consists of a single crystal mirror plate of 1 mm diameter in a gimbal mounting enabling a biresonant oscillation of both axes at a resonance frequency of about 100 Hz and 27 kHz respectively. The mechanical scan angle (MSA) achieved is +/- 7 degrees for the slow and +/- 12 degrees for the fast axis. The mirror angle position and phase can be read out via two piezo-resistive sensors located at the torsion axes. In order to allow for a minimum device size of the resonantly driven slow axis the sensor of the inner fast axis was connected by a new kind of thin silicon conductors. Those are created by means of an etch stop in TMAH etch and kept as thin as possible in order to reduce their contribution to the mechanical stiffness of the mirror-supporting structures. This new system enables to lead six (or even more) independent electrical potentials onto the moving parts of the device, whereas the mechanical properties are mainly determined by only 2 torsion axes. The devices were subsequently characterized and tested. Technology details, simulation results, pictures of the device and the new conductor structures as well as measurement results are presented.
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页数:10
相关论文
共 6 条
[1]   MEMS-Based Pico Projector Display [J].
Davis, Wyatt O. ;
Sprague, Randy ;
Miller, Josh .
2008 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS, 2008, :31-32
[2]  
Hsu S-T., 2008, P SPIE, V6887
[3]  
JARVENPAA T, 2004, SOC INF DISPL SID S, V35, P82, DOI DOI 10.1889/1.1811462
[4]   Bulk micromachining of silicon [J].
Kovacs, GTA ;
Maluf, NI ;
Petersen, KE .
PROCEEDINGS OF THE IEEE, 1998, 86 (08) :1536-1551
[5]   Boron etch-stop in TMAH solutions [J].
Steinsland, E ;
Nese, M ;
Hanneborg, A ;
Bernstein, RW ;
Sandmo, H ;
Kittilsland, G .
SENSORS AND ACTUATORS A-PHYSICAL, 1996, 54 (1-3) :728-732
[6]  
Tauscher J, 2010, P SOC PHOTO-OPT INS, V7594