Micromechanics of crack bridging in sapphire epoxy composites

被引:15
作者
Belnap, JD [1 ]
Shetty, DK [1 ]
机构
[1] Univ Utah, Dept Mat Sci & Engn, Salt Lake City, UT 84112 USA
关键词
composites; micromechanics; fluorescence spectroscopy; crack bridging; matrix cracking;
D O I
10.1016/S0266-3538(98)00042-6
中图分类号
TB33 [复合材料];
学科分类号
摘要
Fracture-mechanics analyses of matrix-cracking stress and fracture toughness of brittle-matrix composites require knowledge of the crack-closure tractions applied by the bridging fibers. The closure fraction is expressed as a relationship between a distributed closure stress (p) and a the local crack-opening displacement (u). The p/u relationship is typically derived rom a micromechanics analysis of stress transfer from the matrix to the fiber in the vicinity of the matrix crack. This paper describes measurements of bridging stresses and crack openings in a model composite made of a brittle epoxy matrix and sapphire filaments coated with release agents to prevent interfacial bonding. Stresses in the crack-bridging sapphire filaments were determined by measuring the shift of the fluorescence lines of trace chromium impurity with a laser microprobe. The measured p/u data were compared with micromechanical models applicable to composites with unbonded, frictional interfaces and found to be consistent with models that predict a lower-bound bridging stress at the crack tip equal to the far-field fiber stress. The implications of this finding for the prediction of the matrix-cracking stress of brittle-matrix composites are discussed ill the paper. (C) 1998 Elsevier Science Ltd. All rights reserved.
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页码:1763 / 1773
页数:11
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