Selective laser melting of tungsten-copper functionally graded material

被引：85

作者：

Tan, Chaolin ^{[1
,2
]}

Zhou, Kesong ^{[1
,2
]}

Kuang, Tongchun ^{[1
]}

机构：

[1] South China Univ Technol, Sch Mat Sci & Engn, Guangzhou 510640, Guangdong, Peoples R China

[2] Guangdong Inst New Mat, Guangzhou 510651, Guangdong, Peoples R China

来源：

MATERIALS LETTERS | 2019年 / 237卷

关键词：

Selective laser melting; Powder technology; FGM; Tungsten; Nuclear materials; W-Cu; MICROSTRUCTURAL CHARACTERIZATION; MARAGING-STEEL; PERFORMANCE; BEHAVIOR;

D O I：

10.1016/j.matlet.2018.11.127

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A tungsten-copper functionally graded material was processed based on SLM additive manufacture despite encountering some difficulties from materials characters. The effect of laser parameter on the interfacial defects and bonding performance are evaluated. The SLM produced tungsten is in columnar structures with random orientation. Plenty of fine tungsten grains are present at the bonding region, owing to a high cooling rate incited by the underlying copper. A metallurgically bonded interface with a 50-80 mu m inter-diffusion region is formed. The interfacial bonding mechanism, which associates with intense Marangoni convection at the interface, is revealed and discussed. (C) 2018 Elsevier B.V. All rights reserved.

引用

页码：328 / 331

页数：4

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