Microwave Package Design for Superconducting Quantum Processors

被引:48
作者
Huang, Sihao [1 ,2 ,3 ]
Lienhard, Benjamin [2 ,3 ]
Calusine, Greg [4 ]
Vepsalainen, Antti [3 ]
Braumuller, Jochen [3 ]
Kim, David K. [4 ]
Melville, Alexander J. [4 ]
Niedzielski, Bethany M. [4 ]
Yoder, Jonilyn L. [4 ]
Kannan, Bharath [2 ,3 ]
Orlando, Terry P. [2 ,3 ]
Gustavsson, Simon [3 ]
Oliver, William D. [2 ,3 ,4 ]
机构
[1] MIT, Dept Phys, Cambridge, MA 02139 USA
[2] MIT, Dept Elect Engn & Comp Sci, Cambridge, MA 02139 USA
[3] MIT, Res Lab Elect, Cambridge, MA 02139 USA
[4] MIT, Lincoln Lab, Lexington, MA 02421 USA
来源
PRX QUANTUM | 2021年 / 2卷 / 02期
关键词
COPPER;
D O I
10.1103/PRXQuantum.2.020306
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Solid-state qubits with transition frequencies in the microwave regime, such as superconducting qubits, are at the forefront of quantum information processing. However, high-fidelity, simultaneous control of superconducting qubits at even a moderate scale remains a challenge, partly due to the complexities of packaging these devices. Here, we present an approach to microwave package design focusing on material choices, signal line engineering, and spurious mode suppression. We describe design guidelines validated using simulations and measurements used to develop a 24-port microwave package. Analyzing the qubit environment reveals no spurious modes up to 11 GHz. The material and geometric design choices enable the package to support qubits with lifetimes exceeding 350 mu s. The microwave package design guidelines presented here address many issues relevant for near-term quantum processors.
引用
收藏
页数:16
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