Validation of Finite Element Structural Simulation for Ohmic Microcontact

被引：0
|
作者：
Liu, Hong [1 ,2 ,3 ]
Leray, Dimitri [1 ,2 ,3 ]
Pons, Patrick [2 ,3 ]
Colin, Stephane [1 ]
Broue, Adrien [2 ,3 ,4 ]
Martegoutte, Julien [4 ,5 ]
机构：
[1] Univ Toulouse, INSA, UPS, ISAE,ICA, 135 Ave Rangueil, F-31077 Toulouse, France
[2] CNRS, LAAS, F-31077 Toulouse, France
[3] Univ Toulouse, UPS, INSA, ISAE LAAS, F-31077 Toulouse, France
[4] NOVAMEMS, F-31401 Toulouse 9, France
[5] Univ Lyon, INSA Lyon, CNRS UMR 5270, F-69621 Villeurbanne, France
来源：
EUROSENSORS XXV | 2011年 / 25卷
关键词：
microswitch; ohmic contact; finite element; structural simulation;
D O I：
10.1016/j.proeng.2011.12.104
中图分类号：
TH7 [仪器、仪表];
学科分类号：
0804 ; 080401 ; 081102 ;
摘要：
In the current literature, there is no model able to accurately predict the electrical resistance value of rough microcontacts. Such model requires a coupled thermo-electro-structural analysis that is very difficult to validate in a straightforward manner. In the present approach, atomic force microscopy (AFM) scanned data of contact surface with roughness are used to build finite element (FE) model. As a first step towards multiphysics analysis, the aim of this study is to validate results of structural simulation of a rough gold micro-contact. A setup with a nanoindenter and a real microswitch is used to extract force-displacement curves. These results are compared to FE simulations which allow evaluating the effects of the main parameters. It is shown that the accuracy of these structural simulations is acceptable for an accurate evaluation of the electrical contact resistance. (C) 2011 Published by Elsevier Ltd.
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页数：4
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