Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications

被引：241

作者：

Schubert, T. ^{[1
]}

Ciupinski, L. ^{[2
]}

Zielinski, W. ^{[2
]}

Michalski, A. ^{[2
]}

Weissgaeber, T. ^{[1
]}

Kieback, B. ^{[1
]}

机构：

[1] Fraunhofer Inst Mfg & Adv Mat, Dept Powder Met & Composite Mat, D-01277 Dresden, Germany

[2] Warsaw Univ Technol, Fac Mat Sci & Engn, PL-02507 Warsaw, Poland

来源：

SCRIPTA MATERIALIA | 2008年 / 58卷 / 04期

关键词：

diamond composite; thermal conductivity; interface structure;

D O I：

10.1016/j.scriptamat.2007.10.011

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Copper/diamond composites were produced by the powder metallurgical method. It is known from former experiments, that there is a very weak bonding between as-received diamonds and pure copper matrix in the consolidated composite. Improvements in bonding strength and thermo-physical properties of the composites were achieved using atomized copper alloy with minor additions of chromium to increase the interfacial bonding in Cu/diamond composites by a thin nano-sized Cr3C2 layer. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：263 / 266

页数：4

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