Thermal fatigue reliability optimisation of flip chip assemblies

被引：0

作者：

Vandevelde, B ^{[1
]}

Beyne, E ^{[1
]}

机构：

[1] IMEC, B-3001 Louvain, Belgium

来源：

BENEFITING FROM THERMAL AND MECHANICAL SIMULATION IN MICRO-ELECTRONICS | 2000年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The thermal cycling life of flip chip assemblies is often limited by solder joint fatigue. The reliability can be increased by a factor 10 using an underfill material. However, the solder joint reliability is still very dependent on the choice of the underfill material. Using thermo-mechanical simulations, based on non linear finite element simulations, the induced inelastic strains in the solder joints are calculated, and give a value for the expected thermal fatigue life. Combing these FE simulations with an optimisation tool, the optimal underfill material is proposed. The optimisation is based on a parameter sensitivity analysis using DOE techniques. The optimal properties for the underfill are a high elastic modulus and a CTE closely matched to the CTE of the solder joint.

引用

页码：165 / 177

页数：13