Sacrificial layer process with laser-driven release for batch assembly operations

A dry sacrificial layer process is presented in which microstructures fabricated on UV-transparent substrates are released by excimer laser ablation of a polymer sacrificial material using laser light incident from the reverse side of the substrate, We investigate the application of this technique to the batch assembly of hybrid microelectromechanical systems (MEMS) built from parts fabricated on different substrates. Preliminary measurements of initial velocity are presented for nickel test structures released from polyimide sacrificial layers using a KrF excimer laser. At fluences in the range 50-250 mJ/cm(2) (i.e., close to the ablation threshold), structures with heights of 100 mu m are shown to exhibit initial velocities in the range 1-5 ms(-1), allowing controlled transfer of parts between substrates. Application of the new assembly method to a MEMS device is demonstrated by assembling arrays of electrostatic wobble motors from component parts fabricated on separate substrates by UV-LIGA processing. [320].