Photoemission study on interfacial reaction of Ti/n-type GaN

被引:8
|
作者
Naono, T [1 ]
Okabayashi, J
Toyoda, S
Fujioka, H
Oshima, M
Hamamatsu, H
机构
[1] Univ Tokyo, Dept Appl Chem, Bunkyo Ku, Tokyo 1138656, Japan
[2] Sumitomo Chem Co Ltd, Ibaraki 3003294, Japan
关键词
Ti/n-type GaN; photoemission spectroscopy; ohmic contact; interfacial reaction;
D O I
10.1016/j.apsusc.2004.10.132
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In order to understand the mechanism of ohmic-contact formation by the annealing of Ti electrodes on n-type GaN, we have investigated the changes in the energy-band structure of Ti/n-type GaN depending on annealing temperature using photoemission spectroscopy. Valence-band spectrum for an as-deposited sample was explained by the simple summation of Ti and GaN spectra. Spectral line shapes significantly changed by annealing at 500 and 700 degrees C, suggesting the formation of a TiN layer. The peak shifts of Ga 3d and N 1s core levels are interpreted as the energy-band bending and interfacial reaction with the formation of the TiN layer. It is revealed that the ohmic-contact formation by the annealing is attributed to the formation of GaN with nitrogen vacancies, which is consistent with the current-voltage characteristics. (c) 2004 Published by Elsevier B.V.
引用
收藏
页码:277 / 280
页数:4
相关论文
共 50 条
  • [1] PHOTOEMISSION CAPACITANCE TRANSIENT SPECTROSCOPY OF N-TYPE GAN
    GOTZ, W
    JOHNSON, NM
    STREET, RA
    AMANO, H
    AKASAKI, I
    APPLIED PHYSICS LETTERS, 1995, 66 (11) : 1340 - 1342
  • [2] Ti Ag ohmic contacts to n-type GaN
    Lee, DJ
    Lee, SH
    Park, HC
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 1999, 34 : S397 - S400
  • [3] Mechanism for Ohmic contact formation of Ti on n-type GaN investigated using synchrotron radiation photoemission spectroscopy
    Kim, JK
    Jang, HW
    Lee, JL
    JOURNAL OF APPLIED PHYSICS, 2002, 91 (11) : 9214 - 9217
  • [4] ELECTRICAL CHARACTERIZATION OF TI SCHOTTKY BARRIERS ON N-TYPE GAN
    BINARI, SC
    DIETRICH, HB
    KELNER, G
    ROWLAND, LB
    DOVERSPIKE, K
    GASKILL, DK
    ELECTRONICS LETTERS, 1994, 30 (11) : 909 - 911
  • [5] Ti/Al Ohmic Contacts to n-Type GaN Nanowires
    Ye, Gangfeng
    Shi, Kelvin
    Burke, Robert
    Redwing, Joan M.
    Mohney, Suzanne E.
    JOURNAL OF NANOMATERIALS, 2011, 2011
  • [6] Effects of annealing on Ti Schottky barriers on n-type GaN
    Hirsch, MT
    Duxstad, KJ
    Haller, EE
    ELECTRONICS LETTERS, 1997, 33 (01) : 95 - 96
  • [7] Analysis of a thin AlN interfacial layer in Ti/Al and Pd/Al ohmic contacts to n-type GaN
    Luther, BP
    DeLucca, JM
    Mohney, SE
    Karlicek, RF
    APPLIED PHYSICS LETTERS, 1997, 71 (26) : 3859 - 3861
  • [8] Correlation of resistance and interfacial reaction of contacts to n-type InP
    Huang, JS
    Vartuli, CB
    Nguyen, T
    Bar-Chaim, N
    Shearer, J
    Fisher, C
    Anderson, S
    JOURNAL OF MATERIALS RESEARCH, 2002, 17 (11) : 2929 - 2934
  • [9] Correlation of resistance and interfacial reaction of contacts to n-type InP
    J. S. Huang
    C. B. Vartuli
    T. Nguyen
    N. Bar-Chaim
    J. Shearer
    C. Fisher
    S. Anderson
    Journal of Materials Research, 2002, 17 : 2929 - 2934
  • [10] The microstructure of Ti/Au contacts on n-type GaN annealed in nitrogen
    Dobos, L.
    Toth, L.
    Pecz, B.
    Horvath, Z. E.
    Toth, A. L.
    Beaumont, B.
    Bougrioua, Z.
    MICROELECTRONIC ENGINEERING, 2012, 90 : 118 - 120