MEMS for wireless communications: 'from RF-MEMS components to RF-MEMS-SiP'

被引：164
作者：
Tilmans, HAC [1 ]
De Raedt, W [1 ]
Beyne, E [1 ]
机构：
[1] IMEC VZW, Div Microsyst, Components & Packaging, B-3001 Louvain, Belgium
来源：
JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2003年 / 13卷 / 04期
关键词：
D O I：
10.1088/0960-1317/13/4/323
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Wireless communication has led to an explosive growth of emerging consumer and military applications of radio frequency (RF), microwave and millimeter wave circuits and systems. Future personal (hand-held) and ground communications systems as well as communications satellites necessitate the use of highly integrated RF front-ends, featuring small size, low weight, high performance and low cost. Continuing chip scaling has contributed to the extent that off-chip, bulky passive RF components, such as high-Q inductors, ceramic and SAW filters, varactor diodes and discrete PIN diode switches, have become limiting. Micro-machining or MEMS technology is now rapidly emerging as an enabling technology to yield a new generation of high-performance RF-MEMS passives to replace these off-chip passives in wireless communication (sub)systems. This paper reviews the progress in RF-MEMS from a device and integration perspective. The worldwide state-of-the-art of RF-MEMS devices including switches, variable capacitors, resonators and filters are described. Next, it Is stipulated how integration of RF-MEMS passives with other passives (as inductors, LC filters, SAW devices, couplers and power dividers) and, active circuitry (ASICs, RFICs) can lead to the so-called RF-MEMS system-in-a-package (RF-MEMS-SiP) modules. The evolution of the RF-MEMS-SIP technology is illustrated using IMEC's microwave multi-layer thin-film MCM-D technology which today already serves as a technology platform for RF-SiP.
引用
收藏
页码：S139 / S163
页数：25
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