Autonomic Restoration of Electrical Conductivity

被引：269
作者：
Blaiszik, Benjamin J. [1 ]
Kramer, Sharlotte L. B. [1 ]
Grady, Martha E. [2 ]
McIlroy, David A. [1 ]
Moore, Jeffrey S. [3 ]
Sottos, Nancy R. [1 ]
White, Scott R. [4 ]
机构：
[1] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA
[2] Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA
[3] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61801 USA
[4] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Aerosp Engn, Urbana, IL 61801 USA
来源：
ADVANCED MATERIALS | 2012年 / 24卷 / 03期
关键词：
stimuli-responsive materials; self-healing materials; microelectronics; electrical conductivity; SELF-HEALING MATERIALS; GALLIUM-INDIUM EGAIN; LIQUID-METAL; INTEGRATION; CIRCUITS; FAILURE; ALLOY;
D O I：
10.1002/adma.201102888
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
Self-healing of an electrical circuit is demonstrated with nearly full recovery of conductance less than one millisecond after damage. Crack damage breaks a conductive pathway in a multilayer device, interrupting electron transport and simultaneously rupturing adjacent microcapsules containing gallium-indium liquid metal (top). The released liquid metal flows to the area of damage, restoring the conductive pathway (bottom).
引用
收藏
页码：398 / +
页数：5
相关论文
共 26 条
  • [1] Cracking in thin multi-layers with finite-width and periodic architectures
    Ambrico, JM
    Jones, EE
    Begley, MR
    [J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2002, 39 (06) : 1443 - 1462
  • [2] Nanocapsules for self-healing materials
    Blaiszik, B. J.
    Sottos, N. R.
    White, S. R.
    [J]. COMPOSITES SCIENCE AND TECHNOLOGY, 2008, 68 (3-4) : 978 - 986
  • [3] In situ poly(urea-formaldehyde) microencapsulation of dicyclopentadiene
    Brown, EN
    Kessler, MR
    Sottos, NR
    White, SR
    [J]. JOURNAL OF MICROENCAPSULATION, 2003, 20 (06) : 719 - 730
  • [4] Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling
    Cale, Timothy S.
    Lu, Jian-Qiang
    Gutmann, Ronald J.
    [J]. CHEMICAL ENGINEERING COMMUNICATIONS, 2008, 195 (08) : 847 - 888
  • [5] Medium-scale carbon nanotube thin-film integrated circuits on flexible plastic substrates
    Cao, Qing
    Kim, Hoon-sik
    Pimparkar, Ninad
    Kulkarni, Jaydeep P.
    Wang, Congjun
    Shim, Moonsub
    Roy, Kaushik
    Alam, Muhammad A.
    Rogers, John A.
    [J]. NATURE, 2008, 454 (7203) : 495 - U4
  • [6] Microcapsules containing suspensions of carbon nanotubes
    Caruso, Mary M.
    Schelkopf, Stuart R.
    Jackson, Aaron C.
    Landry, Alexandra M.
    Braun, Paul V.
    Moore, Jeffrey S.
    [J]. JOURNAL OF MATERIALS CHEMISTRY, 2009, 19 (34) : 6093 - 6096
  • [7] Failure mechanisms of solder interconnects under current stressing in advanced electronic packages
    Chan, Y. C.
    Yang, D.
    [J]. PROGRESS IN MATERIALS SCIENCE, 2010, 55 (05) : 428 - 475
  • [8] Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
    Chen, Chih
    Tong, H. M.
    Tu, K. N.
    [J]. ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 40, 2010, 40 : 531 - 555
  • [9] Eutectic gallium-indium (EGaIn): A moldable liquid metal for electrical characterization of self-assembled monolayers
    Chiechi, Ryan C.
    Weiss, Emily A.
    Dickey, Michael D.
    Whitesides, George M.
    [J]. ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2008, 47 (01) : 142 - 144
  • [10] Adhesion and debonding of multi-layer thin film structures
    Dauskardt, R
    Lane, M
    Ma, Q
    Krishna, N
    [J]. ENGINEERING FRACTURE MECHANICS, 1998, 61 (01) : 141 - 162
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