Effect of Ge Composition on Infrared Detecting Performance of Strain Si/Si1-x-yGexCy Heterojunction on Preferentially Etched Silicon Substrate

被引:0
作者
Chiang, Yen-Ting [1 ]
Fang, Yean-Kuen [1 ]
Chou, Tse-Heng [2 ]
Juang, Feng-Renn [1 ]
Chen, Chei-Chang [1 ]
Lin, Cheng-I [1 ]
Chen, Chii-Wen [3 ]
机构
[1] Natl Cheng Kung Univ, Dept Elect Engn, Inst Microelect, Tainan 701, Taiwan
[2] Wufeng Inst Technol, Dept Elect Engn, Chiayi 621, Taiwan
[3] Ming Hsin Univ Sci & Technol, Dept Elect Engn, Hsinchu 30401, Taiwan
关键词
Heterojunction; IR photodiode; Si1-x-yGexCy; strain-Si; 1.3; MU-M; RAMAN-SPECTROSCOPY; SI; STRESS; MOBILITY; PHOTODIODES; ALLOYS; LAYER;
D O I
10.1109/JSEN.2009.2039132
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The p-strain Si/i-Si1-x-yGexCy heterojunctions prepared by a rapid thermal chemical vapor deposition system on an n-Si substrate with back preferentially etched were developed for fast IR detecting applications. The stress induced by the p-strain Si/i-Si1-x-yGexCy heterojunction enhanced the carrier mobility in p-Si layer, while the preferentially etching of n-Si substrate accelerated the heat dissipating and the reduction of series resistance. As a result, the device achieved a better performance than that of the conventional one without the strain Si or the preferentially etched substrate. In addition, the effects of morphology and Ge composition in the i-Si1-x-yGexCy thin film on the IR detecting performance were investigated in details.
引用
收藏
页码:1337 / 1341
页数:5
相关论文
共 20 条
  • [1] Effect of carbon on the valence band offset of Si1-x-yGexCy/Si heterojunctions
    Chang, CL
    StAmour, A
    Sturm, JC
    [J]. IEDM - INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 1996, 1996, : 257 - 260
  • [2] Carrier mobilities and process stability of strained Si n- and p-MOSFETs on SiGe virtual substrates
    Currie, MT
    Leitz, CW
    Langdo, TA
    Taraschi, G
    Fitzgerald, EA
    Antoniadis, DA
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (06): : 2268 - 2279
  • [3] High-speed amorphous silicon germanium infrared sensors prepared on crystalline silicon substrates
    Ho, JJ
    Fang, YK
    Wu, KH
    Hsieh, WT
    Huang, SC
    Chen, GS
    Ju, MS
    Lin, JJ
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (09) : 2085 - 2088
  • [4] Direct measurement of residual stress in sub-micron interconnects
    Horsfall, AB
    dos Santos, JMM
    Soare, SM
    Wright, NG
    O'Neill, AG
    Bull, SJ
    Walton, AJ
    Gundlach, AM
    Stevenson, JTM
    [J]. SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2003, 18 (11) : 992 - 996
  • [5] NORMAL-INCIDENCE STRAINED-LAYER SUPERLATTICE GE0.5SI0.5/SI PHOTODIODES NEAR 1.3 MU-M
    HUANG, FY
    ZHU, X
    TANNER, MO
    WANG, KL
    [J]. APPLIED PHYSICS LETTERS, 1995, 67 (04) : 566 - 568
  • [6] Normal-incidence epitaxial SiGeC photodetector near 1.3 mu m wavelength grown on Si substrate
    Huang, FY
    Wang, KL
    [J]. APPLIED PHYSICS LETTERS, 1996, 69 (16) : 2330 - 2332
  • [7] Defect related dark current and charge injection in Si1-xGex/Si multiple quantum wells
    Huang, XL
    Jeong, MS
    Ihm, SH
    Cha, OH
    Kim, JY
    Suh, EK
    Lee, HJ
    [J]. SOLID-STATE ELECTRONICS, 1999, 43 (05) : 953 - 959
  • [8] *ICDD, 2002, FIL 75 0590 POWD DIF
  • [9] Embedded SiGe nanoparticles formed by atom beam co-sputtering of Si, Ge, SiO2
    Joshi, Kapil U.
    Kabiraj, D.
    Narsale, A. M.
    Avasthi, D. K.
    Warang, T. N.
    Kothari, D. C.
    [J]. SURFACE & COATINGS TECHNOLOGY, 2009, 203 (17-18) : 2482 - 2485
  • [10] Theoretical analysis of Si1-x-yGexCy near-infrared photodetectors
    Li, BJ
    Chua, SJ
    Fitzgerald, EA
    [J]. OPTICAL ENGINEERING, 2003, 42 (07) : 1993 - 1999