Enhanced thermal conductivity and flame retardancy of polyamide 6/flame retardant composites with hexagonal boron nitride

被引:17
作者
Wang, Liang [1 ]
Zhang, Luchong [1 ]
Fischer, Andreas [2 ]
Zhong, Yuhua [1 ]
Drummer, Dietmar [2 ]
Wu, Wei [1 ]
机构
[1] East China Univ Sci & Technol, Sinogerman Joint Res Ctr Adv Mat, Sch Mat & Engn, Shanghai 200237, Peoples R China
[2] Friedrich Alexander Univ Erlangen Nuremberg, Inst Polymer Technol, D-91058 Erlangen, Germany
关键词
flame retardancy; hexagonal boron nitride; polyamide; thermal conductivity; INTERFACE MATERIALS; ALUMINUM NITRIDE; EPOXY COMPOSITES; THROUGH-PLANE; FILLERS; POLYMERS;
D O I
10.1515/polyeng-2017-0414
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
High performance composite of polyamide 6 (PA6)/flame retardant (FR)/hexagonal boron nitride (hBN) was prepared via twin screw extrusion, followed by injection molding. The heat dissipation of the composite was significantly improved by incorporating 40 vol% of hBN, and the corresponding thermal conductivity was up to 5.701 W/(m . K), nearly 17 times that of the PA6/FR composites. In addition, the combination effect of hBN and FR to the flame retardancy of the composites was observed, and the addition of hBN could dramatically enhance the flame retardancy of composites, achieving a UL94 V-0 rating with a limited oxygen index (LOI) value of 37%. This multifunctional modification would broaden the application field of PA6 composites in light-emitting diode (LED) lamps, electronic products, and so on.
引用
收藏
页码:767 / 774
页数:8
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