Simple formulas to calculate the line parameters of interconnects on conducting substrates

被引：12

作者：

Grabinski, H ^{[1
]}

Konrad, B ^{[1
]}

Nordholz, P ^{[1
]}

机构：

[1] Univ Hannover, Informat Technol Lab, D-30167 Hannover, Germany

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 1998年

关键词：

D O I：

10.1109/EPEP.1998.733992

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Since conducting substrates can significantly affect the performance of integrated circuits models have been developed to describe the influence of the substrate on the signal propagation on interconnects in a simple way. From these models easy formulas for the accurate computation of the frequency dependent line parameters are derived and compared with numerical simulations and measurements.

引用

页码：223 / 226

页数：4

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