Nanometer-Scale III-V MOSFETs

被引:57
作者
Del Alamo, Jesus A. [1 ]
Antoniadis, Dimitri A. [1 ]
Lin, Jianqiang [1 ,2 ]
Lu, Wenjie [1 ]
Vardi, Alon [1 ]
Zhao, Xin [1 ]
机构
[1] MIT, Microsyst Technol Labs, Cambridge, MA 02139 USA
[2] Argonne Natl Lab, Ctr Nanoscale Mat, Argonne, IL 60439 USA
来源
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY | 2016年 / 4卷 / 05期
基金
美国国家科学基金会;
关键词
III-V compound semiconductors; CMOS; InGaAs; InGaSb; LAYER-DEPOSITED AL2O3; FIELD-EFFECT TRANSISTOR; OHMIC CONTACTS; IN0.7GA0.3AS CHANNEL; INGAAS; PERFORMANCE; SILICON;
D O I
10.1109/JEDS.2016.2571666
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
After 50 years of Moore's Law, Si CMOS, the mainstream logic technology, is on a course of diminishing returns. The use of new semiconductor channel materials with improved transport properties over Si offer the potential for device scaling to nanometer dimensions and continued progress. Among new channel materials, III-V compound semiconductors are particularly promising. InGaAs is currently the most attractive candidate for future III-V based n-type MOSFETs while InGaSb is of great interest for p-channel MOSFETs. At the point of most likely deployment, devices based on these semiconductors will have a highly three-dimensional architecture. This paper reviews recent progress toward the development of nanoscale III-V MOSFETs based on InGaAs and InGaSb with emphasis on scalable technologies and device architectures and relevant physics. Progress in recent times has been brisk but much work remains to be done before III-V CMOS can become a reality.
引用
收藏
页码:205 / 214
页数:10
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