Continuum based modeling of silicon integrated circuit processing: An object oriented approach

被引:79
作者
Law, ME [1 ]
Cea, SM
机构
[1] Univ Florida, Dept Elect Engn, Gainesville, FL 32611 USA
[2] Intel Corp, TCAD Dept, Hillsboro, OR USA
基金
美国国家科学基金会;
关键词
D O I
10.1016/S0927-0256(98)00020-2
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Continuum based integrated circuit process modeling is the dominant tool used to investigate and understand integrated circuit (IC) development. This paper describes the commonly used models for implantation, diffusion, and material growth. In addition, the supporting numerical techniques are described. This paper focuses on the implementation in object oriented code, Florida Object Oriented Process Simulator (FLOOPS). The software architecture is described for implementing models and numerics. A number of process examples are introduced and discussed. (C) 1998 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:289 / 308
页数:20
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