UK lags in Pb-free race

被引：0
|
作者：
不详
机构：
来源：
ELECTRONICS WORLD | 2003年 / 109卷 / 1811期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：5 / 5
页数：1
相关论文
共 50 条
  • [1] Pb-free resistor for Pb-free LTCC system
    Fukaya, M
    Higuchi, C
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 636 - 641
  • [2] There's more to Pb-free production than just a Pb-free product
    IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, : 149 - 149
  • [3] Wetting characteristics of Pb-free solder pastes and Pb-free PWB finishes
    Sattiraju, SV
    Dang, B
    Johnson, RW
    Li, Y
    Smith, JS
    Bozack, MJ
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1338 - 1344
  • [4] A total Pb-free solution
    Circ Assem, 2006, 8 (17):
  • [5] Implementing Pb-free soldering
    Anderson, Iver E.
    Kirkland, Kenneth
    Willenberg, Wayne
    Surface mount technology, 2000, 14 (11): : 78 - 81
  • [6] Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly
    Tanaka, H
    Tanimoto, M
    Matsuda, A
    Uno, T
    Kurihara, M
    Shiga, S
    JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) : 1216 - 1223
  • [7] Preparing for the Pb-free generation
    Anon
    Electronic Packaging and Production, 2001, 41 (08):
  • [8] Electromigration in Pb-free Solders
    Lu, Minhua
    Shih, Da-Yuan
    Lauro, Paul
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 956 - 963
  • [9] Pb-free defects and mitigation : Common problems of Pb-free soldering, and how to solve them
    Vitronics Soltec BV
    Circ Assem, 2006, 2 (86):
  • [10] Pb-free surface-finishing on electronic components’ terminals for Pb-free soldering assembly
    Hitoshi Tanaka
    Morimasa Tanimoto
    Akira Matsuda
    Takeo Uno
    Masaaki Kurihara
    Shoji Shiga
    Journal of Electronic Materials, 1999, 28 : 1216 - 1223
12345