Demystifying 3D ICs: The procs and cons of going vertical

被引：503

作者：

Davis, WR ^{[1
]}

Wilson, J ^{[1
]}

Mick, S ^{[1
]}

Xu, M ^{[1
]}

Hua, H ^{[1
]}

Mineo, C ^{[1
]}

Sule, AM ^{[1
]}

Steer, M ^{[1
]}

Franzon, PD ^{[1
]}

机构：

[1] N Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27695 USA

来源：

IEEE DESIGN & TEST OF COMPUTERS | 2005年 / 22卷 / 06期

关键词：

D O I：

10.1109/MDT.2005.136

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

As 3D technologies become technologically viable, there is increasing interest in determining the achievable payoff. This article first presents an overview of 3D technologies and introduces the motivation for moving from 2D to 3D. It then presents a case study of a fast-Fourier-transform design to illustrate the advantages of going to the third dimension. © 2005 IEEE.

引用

页码：498 / 510

页数：13

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