Diffusion-limited reactive wetting: Spreading of Cu-Sn-Ti alloys on vitreous carbon

被引:32
作者
Dezellus, O [1 ]
Hodaj, F
Mortensen, A
Eustathopoulos, N
机构
[1] Inst Natl Polytech Grenoble, LTPCM, URA 29, CNRS, F-38402 St Martin Dheres, France
[2] Ecole Polytech Fed Lausanne, Dept Mat, Swiss Fed Inst Technol, CH-1015 Lausanne, Switzerland
关键词
reactive wetting; interfaces; contact angle; diffusion; spreading;
D O I
10.1016/S1359-6462(01)00946-0
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
When wetting is promoted by interfaces, the rate at which the liquid spreads over the solid substrate is controlled by the rate at which the well-wetted interfacial product can be formed along the liquid/solid/atmospheric triple line. If this reaction involves a reactive alloy addition to the liquid, the rate of spreading can be limited by two phenomena. A simplified analysis of diffusion-limited reactive spreading of Cu-Sn-Ti alloys on vitreous carbon was conducted based on the assumption that the interfacial reaction is strictly localized at the triple line. The addition of 3at.%Ti to Cu-15at.%Sn led to very good wetting on vitreous carbon. This was due to the formation, at the interface, of a continuous layer of TiC.
引用
收藏
页码:2543 / 2549
页数:7
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