Glass Interposer Integrated Millimeter Wave Antennas for Inter-/Intra Communications

被引:0
|
作者
Yoon, Yong-Kyu [1 ]
Hwangbo, Seahee [1 ]
Rahimi, Arian [1 ]
Fang, Sheng-Po [1 ]
Schumann, Todd [1 ]
机构
[1] Univ Florida, Elect & Comp Engn, Gainesville, FL 32611 USA
关键词
glass interposer; millimeter wave antenna; inter chip communication; intra chip communication; wireless interconnects;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Millimeter wave antennas are integrated in the glass interposer layer for wireless inter-/intra chip/board communications. For in-plane communication, a disc loaded monopole antenna with an omni-directional radiation pattern is designed while for out-of plane communication, a similar architecture with patch mode radiation is configured. These antennas are useful for wireless interconnects in three dimensional integrated systems in package.
引用
收藏
页码:62 / 64
页数:3
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