Special section on Imaging through scattering media

被引：0
|
作者：
Boas, DA [1 ]
Bouman, CA
Webb, KJ
机构：
[1] Harvard Univ, Sch Med, Massachusetts Gen Hosp, Charlestown, MA 02129 USA
[2] Purdue Univ, Sch Elect & Comp Engn, W Lafayette, IN 47907 USA
来源：
JOURNAL OF ELECTRONIC IMAGING | 2003年 / 12卷 / 04期
关键词：
D O I：
10.1117/1.1601618
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：581 / 582
页数：2
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