Infrared thermography for inspecting the adhesion integrity of plastic welded joints

被引：28

作者：

Omar, M ^{[1
]}

Hassan, M

Donohue, K

Saito, K

Alloo, R

机构：

[1] Univ Kentucky, Dept Mech Engn, Lexington, KY 40506 USA

[2] Univ Kentucky, Dept Elect Engn, Lexington, KY 40506 USA

[3] Toyota Motor Mfg N Amer Inc, Erlanger, KY 41018 USA

来源：

NDT & E INTERNATIONAL | 2006年 / 39卷 / 01期

关键词：

plastic kissing bonds; adhesion uniformity; bond strength; pull force; dynamic tomography; delaminations detection;

D O I：

10.1016/j.ndteint.2005.04.008

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

This work aim at developing a non-destructive tool for the evaluation of bonded plastic joints. The paper examines infrared thermographic transmission and reflection mode imaging and validates the feasibility of the thermal NDT approach for this application. Results demonstrate good estimation performance for adhesion integrity, uniformity and bond strength using a transmission mode application of infrared thermography. In addition, results from a pulsed infrared thermographic application using a modified dynamic infrared tomography scheme show good performance for estimating adhesion layer thickness mapping and detecting delaminations. (c) 2005 Elsevier Ltd. All rights reserved.

引用

页码：1 / 7

页数：7

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