Moisture absorption and diffusion characterization of molding compound

被引:51
作者
Chen, X [1 ]
Zhao, SF
Zhai, L
机构
[1] Tianjin Univ, Sch Chem Engn & Technol, Tianjin 300072, Peoples R China
[2] Freescale Semicond Inc, Tianjin 300072, Peoples R China
关键词
D O I
10.1115/1.2065707
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick's Law, but it does not strictly obey at higher temperature and humidity. The phenomena can be attributed to the occurrence of the second phase, and the Fick's Law can be modified by diffusion coefficient varying with the moisture concentration. The predicted value by the modified Ficks Law agrees with the test data. At certain temperature, the saturated moisture content Of molding compound is proportional to the relative humidity, and the proportional factor is the product of solubility and saturated vapor pressure. The solubility is a physical characteristic, which has no relations with the relative humidity of ambient air.
引用
收藏
页码:460 / 465
页数:6
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