Current-assisted direct Cu/Cu joining

被引：7

作者：

Shin, Chanho ^{[1
]}

Ma, Sung Woo ^{[1
]}

Lee, Jeong Hwan ^{[3
]}

Kim, Ki Bum ^{[3
]}

Suh, Minsuk ^{[3
]}

Kim, Namseog ^{[3
]}

Kim, Young-Ho ^{[1
,2
]}

机构：

[1] Hanyang Univ, Div Nanoscale Semicond Engn, Seoul 133791, South Korea

[2] Hanyang Univ, Div Mat Sci & Engn, Seoul 133791, South Korea

[3] SK Hynix Semi Inc, Ichon 467701, Kyoungki Do, South Korea

来源：

SCRIPTA MATERIALIA | 2015年 / 104卷

关键词：

Joining; Electromigration; Joule heating; Cu/Cu direct; INTERFACIAL REACTIONS; TEMPERATURE; ELECTROMIGRATION; SOLDERS;

D O I：

10.1016/j.scriptamat.2015.03.016

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Enhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240-300 degrees C for 10-50 min under 40 MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region increased and the interface became less straight as the current increased. These results are ascribed to electromigration and joule heating effects. The enhanced diffusion contributed significantly to the joining of metals. (C) 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：21 / 24

页数：4

共 30 条

[1] Application of magnetic pulse welding technique for flexible printed circuit boards (FPCB) lap joints [J].

Aizawa, Tomokatsu ;

Okagawa, Keigo ;

Kashani, Mehrdad .

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2013, 213 (07) :1095-1102

[2] High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints [J].

Alam, MO ;

Wu, BY ;

Chan, YC ;

Tu, KN .

ACTA MATERIALIA, 2006, 54 (03) :613-621

[3] Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints [J].

Chao, Brook ;

Chae, Seung-Hyun ;

Zhang, Xuefeng ;

Lu, Kuan-Hsun ;

Ding, Min ;

Im, Jay ;

Ho, Paul S. .

JOURNAL OF APPLIED PHYSICS, 2006, 100 (08)

[4] Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures [J].

Chen, CM ;

Chen, SW .

ACTA MATERIALIA, 2002, 50 (09) :2461-2469

[5] Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin-silver-copper (Sn-Ag-Cu) solders on silver (Ag) surface-finished copper (Cu) substrates [J].

Fouzder, Tama ;

Chan, Y. C. ;

Chan, Daniel K. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (12) :5375-5387

[6] High strength and ductility of friction-stir-welded steel joints due to mechanically stabilized metastable austenite [J].

Fujii, Hidetoshi ;

Ueji, Rintaro ;

Morisada, Yoshiaki ;

Tanigawa, Hiroyasu .

SCRIPTA MATERIALIA, 2014, 70 :39-42

[7]

Gu T, 2014, ELECTRON MATER LETT, V10, P851, DOI [10.1007/s13391-014-3286-4, 10.1007/s13391-014-014-3286-4]

[8] Effects of assembly process parameters on the structure and thermal stability of Sn-capped Cu bump bonds [J].

Huffman, Alan ;

Lueck, Matthew ;

Bower, Christopher ;

Temple, Dorota .

57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, :1589-+

[9] Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA) [J].

Kim, Sun-Chul ;

Kim, Young-Ho .

CURRENT APPLIED PHYSICS, 2013, 13 :S14-S25

[10] Room temperature Cu-Cu direct bonding using surface activated bonding method [J].

Kim, TH ;

Howlader, MMR ;

Itoh, T ;

Suga, T .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (02) :449-453

← 1 2 3 →