Temperature Field Analysis in Grinding

被引:3
作者
Lishchenko, Natalia [1 ]
Larshin, Vasily [2 ]
机构
[1] Odessa Natl Acad Food Technol, 112 Kanatna St, UA-65039 Odessa, Ukraine
[2] Odessa Natl Polytech Univ, 1 Shevchenko Ave, UA-65044 Odessa, Ukraine
来源
ADVANCES IN DESIGN, SIMULATION AND MANUFACTURING II | 2020年
关键词
Grinding wheel; Grinding temperature; Moving heat source; THERMAL-ANALYSIS;
D O I
10.1007/978-3-030-22365-6_20
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The paper is devoted to solving an important scientific problem of determining the profile grinding temperature based on the choice of a not complex but at the same time adequate solution from the available analytical ones. The initial prerequisite for the paper developing concept is that of a moving heat source. In engineering applications, the moving heat source is often represented in the form of a moving contact zone between the grinding wheel and the workpiece surface. The source forms around itself a three-, two- or one-dimensional temperature field in the Cartesian coordinate system with (three-dimensional) and without (two- or one-dimensional) taking into account the influence of the source length in the direction, which is perpendicular to the direction of the source moving, respectively. There is another possibility to simplify the determination of grinding temperature by choosing a one-dimensional solution of the differential equation of heat conduction in which the moving heat source is absent and replaced by the time of action of an unmoving heat source. This time is equal to the ratio of the contact length (in the direction of moving) to the velocity of its movement. Due to the high speeds of the discontinuous profile grinding process, the replacement of the moving source with the unmoving (stationary) one often does not affect the accuracy of determining the profile grinding temperature on the surface and in a thin surface layer.
引用
收藏
页码:199 / 208
页数:10
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