Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

被引:109
作者
Andersson, C
Lai, Z
Liu, J
Jiang, H
Yu, Y
机构
[1] Chalmers Univ Technol, SMIT Ctr, Div Elect Prod, IVF, SE-43153 Molndal, Sweden
[2] Univ Sci & Technol Beijing, Beijing 100083, Peoples R China
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2005年 / 394卷 / 1-2期
关键词
lead-free; fatigue; low cycle fatigue; solder joints; bulk; electronics;
D O I
10.1016/j.msea.2004.10.043
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Low-cycle isothermal mechanical fatigue testing of bulk solders and solder joints of eutectic Sn-37 wt% Pb, Sn-3.5 wt% Ag and Sn-4.0 wt% Ag-0.5 wt% Cu were carried out at room temperature over a wide range of strains (1-10%). The fatigue results of both bulk and solder joints were compared; the eutectic Sn-37 wt% Pb was used as reference. Concerning bulk solders and solder joints, the two lead-free solders showed better fatigue properties than Sn-37Pb. For all three solder alloys tested, bulk solders showed better fatigue performance than solder joints when subjected to higher strains. The situation was the opposite at lower strains, resulting in bulk solders depicting larger values for the Coffin-Manson fatigue exponent and ductility coefficient compared to solder joints. (c) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:20 / 27
页数:8
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