A Broadband SSO Modeling for a Weak Signal Return-Path System Based on the Large-Scale Signal-Power Combined Three-dimensional Full-Wave BEM Solver Model

被引：1

作者：

Oikawa, Ryuichi ^{[1
]}

Gope, Dipanjan ^{[2
]}

Jandhyala, Vikram ^{[2
]}

机构：

[1] NEC Elect Corp, Nakahara Ku, 1753 Shimonumabe, Kawasaki, Kanagawa 2118668, Japan

[2] Physware Inc, Bellevue, WA 98004 USA

来源：

2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2010年

关键词：

D O I：

10.1109/ECTC.2010.5490806

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An over-2Gbps SSO analysis for a low-cost wire-bonding type BGA package with 32bit DDR interface is demonstrated. The analysis is based on the true transistor-level signal-power integrity simulation, a large-scale, full-wave, full-three dimensional BEM field solver package model and return-path decomposition method which eliminates artificial return-path discontinuities. The simulation results suggests that in the weak return-path system, such as wire-bonding type package, the system performance is mainly dominated by the signal channel design rather than the power supply design in over 2Gbps region, which includes the power supply acting as a secondary signal return-path rather than noise source. The power supply design should be mainly focused on the main driver/pre-driver power supply noise interference in those systems.

引用

页码：638 / 645

页数：8

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