Thermal Annealing Effect on Structure and Properties of Tungsten Surface Irradiated with High Fluence and Low Energy Alpha-Particles

The paper presents research into the surface morphology, helium cluster formation and mechanical properties of high-purity tungsten after the high fluence and low-energy helium ion implantation and subsequent annealing. Investigations are based on scanning electron and atomic force microscopy observations and thermal desorption measurements. Because of the local stresses appearing within the energy loss straggling of helium ions, atoms migrate at distances significantly increasing the ion projective range, and create mobile coalescence of helium atoms and immobile helium-vacancy clusters. The latter form helium bubbles in the energy loss straggling which cause the surface blistering. Local stresses induced by helium coalescence and helium-vacancy clusters beyond the energy loss straggling result in the material strengthening or hardness increase. Subsequent 600 degrees C annealing provides the size growth of blisters on the metal surface irradiated with helium ions and high helium desorption due to the migration of mobile coalescence of helium atoms. With the increasing annealing temperature from 600 to 1000 degrees C, the layer corresponding to the projective range of helium ions fully fractures due to the interstitial helium atoms releasing from immobile helium-vacancy clusters. After 1000 degrees C annealing, the tungsten hardness returns to its initial value.